![]() ![]() Still not the same spreading capability as tin lead material but much better then the older lead free solder paste products.Īs always, work with your materials and component suppliers to identify the correct reflow environment and reflow profile for your operation. The newer lead free solder pastes we have printed and reflowed spread much better. They certainly reflowed but almost did not spread at all. We have all seen the pictures of lead free solder paste that remained in its printed location after reflow soldering. The first lead free solder pastes we printed and reflowed six years ago barely moved from their printed shape and position. In our work we have seen a dramatic improvement on the solderability of lead free solder pastes over the last six years. Equivalent to lead wave soldering, lead reflow soldering shares the same commonly-used solder paste ingredient, that is, Sn37Pb eutectic solder paste and. There are certainly benefits to Nitrogen atmosphere in a reflow oven, however your lead free solder paste, components, board material, board finish, and other factors will determine what if any benefit Nitrogen will have for your operation. However we have other customers running lead free processes with Nitrogen. We have many customers operating lead free processes without Nitrogen. He is responsible for the technical service and application engineering for Henkel's electronics assembly materials, including solder paste, underfills, PCB protection materials, and underfills. Brian Toleno is the Application Engineering Team leader for Henkel Technologies. The use of nitrogen reduces the amount of dross, reduces the chance of bridging and other defects.ĭr. Where we do see a need to implement nitrogen is in the wave soldering process. Once the powder sizes go below Type IV and/or with some exotic alloys the use of nitrogen may be required in order to produce reliable, well wetted components. ![]() Advances in solder paste technology have produced materials that are Pb-free air-reflow compatible that produce no-clean residues that are clear, colorless, and pin testable. As long as we are talking about SAC alloys using Type III or Type IV powder in the paste. It is certainly possible to manufacture and reflow surface mount assemblies using Pb-free soldering materials without using nitrogen. ![]() Is it possible to run Pb-Free reflow without nitrogen? We know that nitrogen will improve the solderability of our assemblies, but nitrogen does adds significant cost. Is it possible to run Pb-Free reflow without nitrogen? ![]()
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